UK Electronics jobs

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Location:Bristol
Pay:£35 to £42
Type:Contract
Start:02/05/2013
Duration:2months +
Added:18/05/13
Ref:J22029
35-42 p/h Microcontrollers, assembler, Bristol, C, UML, Linux, Firmware, Embedded, Test Based in the South West, our client is current seeking a Firmware Engineer on a short term 2 month project to help get them over the finish line with a number of pending deadlines. This role is to start within the next week, so applicants must be currently avail
Location:Bristol
Pay:£45K to £55K
Type:Permanent
Added:18/05/13
Ref:J21083
Senior Hardware Design - Apps, Mobile, High Speed Based in Bristol the Hardware Applications Engineer will be responsible for managing all aspects of application support, including systems design, providing system integration and testing. Specific responsibilities will include: Developing and delivering technical content, providing technical traini
Location:Berkshire
Pay:£0
Type:Permanent
Added:18/05/13
Ref:J20175
This is a new urgent requirement for an FPGA Design Engineer to work on exciting new development targeted at Video and Broadcast Markets. Based in the Thames Valley, the FPGA Design Engineer will be tasked with FPGA Design, utilising VHDL and responsibilities will include inventions and problem solving. The successful candidate will come from a bac
Location:North East England
Pay:£40K to £55K
Type:Permanent
Added:18/05/13
Ref:J21667
Senior RF Antenna Engineer – Midlands A great opportunity has come about for a skilled RF Antenna Engineer with a broad background in various small form and large satellite antennas to join a multinational antenna manufacturer based in the Midlands. Responsibilities will include: - RF Design - PCB Layout - Antenna Simulation - Antenna Design
Location:Milan
Pay:£21,432.50 to £25,
Type:Permanent
Added:18/05/13
Ref:J21691
Junior Analog / Mixed Signal IC Layout Engineer – Italy - Italian Speaker Our client, a world class multinational semiconductor company currently seeks a Junior Analog IC Design for their design centre located close to Milan, Italy. In this role you will be responsible for the layout of Analog and RF blocks, the extraction of parasitic devic
Location:Germany
Pay:£60,011 to £64,297
Type:Permanent
Added:18/05/13
Ref:J21911
High Voltage Process Device Expert - Malaysia / Germany Our international client is currently searching for a HV Process Device Expert to be responsible for the process development of HV devices. The role will involve device simulation (TCAD) work as well as electrical characterisation and performing device reliability of products. Required experie
Location:Singapore
Pay:£0
Type:Permanent
Added:18/05/13
Ref:J20795
Wafer Level Packaging MEMS Engineer - Singapore Our international client is now searching for a Wafer Level Packaging MEMS Engineer to be responsible for developing wafer level encapsulation / packaging technology for MEMS devices. The role will involve designing new packages as well as process integration for MEMS packaging, plus working with the
Location:Cambridge
Pay:£0
Type:Permanent
Added:18/05/13
Ref:J20071
This is a superb opportunity for a Digital ASIC Design Engineer to join one of the biggest names in electronics. Our client, a household name in wireless communications, is offering a rare (and exceptional!) opportunity for a junior Digital ASIC Design Engineer to join their team in Cambridge. In this role you will work within a small group of high
Location:South East England
Pay:£28K to £32K
Type:Permanent
Added:18/05/13
Ref:J21012
Semiconductor Equipment Field Service Engineer Are you an experienced field service engineer, supporting high tech equipment used in the manufacturing of semiconductor, Aerospace, Medical, Power device technology and more? Are you looking for a new challenge, and opportunity, particularly in high end inspection technology? Our client is one of the
Location:East of England
Pay:£0
Type:Permanent
Added:18/05/13
Ref:J20796
Semiconductor Packaging Engineer Our client now requires a Semiconductor Packaging Engineer to be responsible for providing technical advice and support on advanced packaging solutions. Working on processes such as wire-bonding, die attach and soldering will be required as well as interfacing between external suppliers and internal departments. Req
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Sun May 19 07:08:10 2013